MS in Engineering & Technology Innovation Management

• Coursework: Electromechanical Systems Design, Data Science, Product Management, Quantitative Entrepreneurship

BS in Mechanical Engineering

• Coursework: Machine Design, Controls, FEA, Statics & Dynamics, Heat & Mass Transfer, Thermodynamics, Fluid Mechanics

Plumbing & Fluid Systems Engineer // Fremont, CA

• Led cost-reduction efforts on the existing fluid and plumbing systems; position eliminated in a company-wide restructuring.

NPI Engineer Intern // Pittsburgh, PA

• Designed and prototyped a custom automated sieve-feeding mechanism in Fusion 360 for clump breakdown of proprietary PU foam powder, increasing manufacturing throughput by 300%.
• Coordinated three external laboratories validating PU foam-additive formulations against applicable ASTM standards.

Hardware Engineering Intern // Mountain View, CA

• Took over an undocumented hydrogen dryer program with a senior engineer and one other intern after its lead departed, running temperature-profile, time-to-temperature, and time-to-saturation experiments to reconstruct its behavior.
• With pressure-swing adsorption ruled out by the system's operating conditions, modified the unit toward temperature-swing by re-specifying O-rings, adding PID-controlled heating tapes, and revising insulation and sensor layout; stabilized erratic dew-point readings, then showed the existing design could not support in-situ regeneration.
• Co-proposed the pilot architecture the team built: three off-the-shelf aluminum columns with ex-situ desiccant regeneration, replacing the PSA unit's stainless steel, with embrittlement judged an acceptable risk over a 1.5-month pilot.
• Delivered and validated the pilot dryer with the team, extending continuous drying from 6 to 30 hours and pushing desiccant replacement out to once every 3.5 days; co-authored the program's only knowledge-transfer document.
• Designed and built a sheet-metal test stand to evaluate power-supply behavior and troubleshoot I2C faults.
• Designed leak-mitigating open-tray housings for electrolyzer stacks with drainage slopes, protective geometry, and Sorbothane feet for vibration damping and insulation, iterating the design through 3D-printed prototypes.

Research & Development Intern // Pune, India

• Mapped lab-measured mold geometry to production tires and irregular-wear reports, quantifying how variation in mold roundness drove long-term wear on truck tires.

Undergraduate Research Assistant // West Lafayette, IN

• Designed and simulated a 9 × 9 dielectric elastomer actuator array in Abaqus under 100% equibiaxial prestretch, mapping temperature to applied voltage on thermally coupled elements; ran the voltage sweep that generated the 10,000-case strain-field dataset used to train the array's deep-learning controller.

Process Quality Engineering Intern // Greenville, SC

• Investigated a high-priority scrap defect by inspecting 500+ tires and recording multi-parameter data; designed a go/no-go gauge, iterated 3D-printed prototypes with operator feedback, and drove a 100-unit stainless steel rollout applying DFM.

Deep Learning for Strain Field Customization in Bioreactor with Dielectric Elastomer Actuator Array

Wang J., Sarkar D., Mohan A., Lee M., Ma Z., Chortos A.

Cyborg and Bionic Systems (Science Partner Journal, AAAS), Aug 2024[DOI: 10.34133/cbsystems.0155]

• Designed and assembled a robotic launcher in Fusion 360, integrating feeding, actuation, and aiming subsystems; wrote Arduino firmware coordinating servo and stepper mechanisms, validated through iterative prototype builds.

• Designed a chassis optimized for sheet metal fabrication in Fusion 360 with attention to bend allowances, fastener integration, and internal component clearances; validated fitment via full-scale 3D-printed prototypes applying DFM principles throughout.

• Led technical design for a wearable necklace integrating 8 ultrasonic sensors, 8 infrared sensors, and 8 haptic motors to relay 360° environmental information; implemented I2C protocol with an Arduino Nano to coordinate all peripherals, reducing device size and wiring complexity.